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FSBB15CH60 Smart Power Module
April 2005
FSBB15CH60
Smart Power Module
Features
* UL Certified No.E209204 (SPM27-CA package) * Very low thermal resistance due to using DBC * 600V-15A 3-phase IGBT inverter bridge including control ICs for gate driving and protection * Divided negative dc-link terminals for inverter current sensing applications * Single-grounded power supply due to built-in HVIC * Isolation rating of 2500Vrms/min.
SPM
General Description
TM
Applications
* AC 100V ~ 253V three-phase inverter drive for small power ac motor drives * Home appliances applications like air conditioner and washing machine.
It is an advanced smart power module (SPMTM) that Fairchild has newly developed and designed to provide very compact and high performance ac motor drives mainly targeting lowpower inverter-driven application like air conditioner and washing machine. It combines optimized circuit protection and drive matched to low-loss IGBTs. System reliability is further enhanced by the integrated under-voltage lock-out and shortcircuit protection. The high speed built-in HVIC provides optocoupler-less single-supply IGBT gate driving capability that further reduce the overall size of the inverter system design. Each phase current of inverter can be monitored separately due to the divided negative dc terminals.
Top View
44mm
Bottom View
26.8mm
Figure 1.
(c)2005 Fairchild Semiconductor Corporation
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FSBB15CH60 Rev. C
FSBB15CH60 Smart Power Module
Integrated Power Functions
* 600V-15A IGBT inverter for three-phase DC/AC power conversion (Please refer to Figure 3)
Integrated Drive, Protection and System Control Functions
* For inverter high-side IGBTs: Gate drive circuit, High voltage isolated high-speed level shifting Control circuit under-voltage (UV) protection Note) Available bootstrap circuit example is given in Figures 10 and 11. * For inverter low-side IGBTs: Gate drive circuit, Short circuit protection (SC) Control supply circuit under-voltage (UV) protection * Fault signaling: Corresponding to a UV fault (Low-side supply) * Input interface: 3.3/5V CMOS/LSTTL compatible, Schmitt trigger input
Pin Configuration
Top View
13.7
(1) VCC(L) (2) COM (3) IN(UL) (4) IN(VL) (5) IN(WL) (6) VFO (7) CFOD (8) CSC (9) IN(UH) (10) VCC(UH) (11) VB(U) (12) VS(U) (13) IN(VH) (14) VCC(VH) (15) VB(V) (16) VS(V) (17) IN(WH) (18) VCC(WH) (19) VB(W) (20) VS(W)
(21) NU (22) NV
19.2
(23) NW
(24) U
Case Temperature (T ) C Detecting Point
(25) V
(26) W DBC Substrate (27) P
Figure 2.
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FSBB15CH60 Smart Power Module
Pin Descriptions
Pin Number
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
Pin Name
VCC(L) COM IN(UL) IN(VL) IN(WL) VFO CFOD CSC IN(UH) VCC(UH) VB(U) VS(U) IN(VH) VCC(VH) VB(V) VS(V) IN(WH) VCC(WH) VB(W) VS(W) NU NV NW U V W P Common Supply Ground Signal Input for Low-side U Phase Signal Input for Low-side V Phase Signal Input for Low-side W Phase Fault Output
Pin Description
Low-side Common Bias Voltage for IC and IGBTs Driving
Capacitor for Fault Output Duration Time Selection Capacitor (Low-pass Filter) for Short-Current Detection Input Signal Input for High-side U Phase High-side Bias Voltage for U Phase IC High-side Bias Voltage for U Phase IGBT Driving High-side Bias Voltage Ground for U Phase IGBT Driving Signal Input for High-side V Phase High-side Bias Voltage for V Phase IC High-side Bias Voltage for V Phase IGBT Driving High-side Bias Voltage Ground for V Phase IGBT Driving Signal Input for High-side W Phase High-side Bias Voltage for W Phase IC High-side Bias Voltage for W Phase IGBT Driving High-side Bias Voltage Ground for W Phase IGBT Driving Negative DC-Link Input for U Phase Negative DC-Link Input for V Phase Negative DC-Link Input for W Phase Output for U Phase Output for V Phase Output for W Phase Positive DC-Link Input
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Internal Equivalent Circuit and Input/Output Pins
P (27)
(19) VB(W ) (18) VCC(W H )
VB VCC COM IN OU T VS
W (26)
(17) IN (W H) (20) VS(W ) (15) VB(V) (14) VCC(VH)
VB VCC COM IN OU T VS
V (25)
(13) IN (VH) (16) VS(V) (11) VB(U) (10) VCC(UH)
VB VCC COM IN VS
U (24)
OU T
(9) IN (UH) (12) VS(U)
(8) C SC (7) C FO D (6) VFO
C(SC) C(FOD) VFO
OUT(W L)
N W (23)
(5) IN (W L) (4) IN (VL) (3) IN (UL) (2) COM (1) VCC(L)
IN(W L) OUT(VL) IN(VL) IN(UL) COM VCC OUT(UL) VSL
N U (21) N V (22)
Note: 1. Inverter low-side is composed of three IGBTs, freewheeling diodes for each IGBT and one control IC. It has gate drive and protection functions. 2. Inverter power side is composed of four inverter dc-link input terminals and three inverter output terminals. 3. Inverter high-side is composed of three IGBTs, freewheeling diodes and three drive ICs for each IGBT.
Figure 3.
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FSBB15CH60 Smart Power Module
Absolute Maximum Ratings (TJ = 25C,
Inverter Part Symbol
VPN VPN(Surge) VCES IC ICP PC TJ
Note:
Unless Otherwise Specified)
Parameter
Supply Voltage Supply Voltage (Surge) Collector-emitter Voltage Each IGBT Collector Current Each IGBT Collector Current (Peak) Collector Dissipation Operating Junction Temperature TC = 25C
Conditions
Applied between P- NU, NV, NW Applied between P- NU, NV, NW
Rating
450 500 600 15 30 50 -20 ~ 125
Units
V V V A A W C
TC = 25C, Under 1ms Pulse Width TC = 25C per One Chip (Note 1)
1. The maximum junction temperature rating of the power chips integrated within the SPM is 150 C(@TC 100C). However, to insure safe operation of the SPM, the average junction temperature should be limited to TJ(ave) 125C (@TC 100C)
Control Part Symbol
VCC VBS VIN VFO IFO VSC
Parameter
Control Supply Voltage High-side Control Bias Voltage Input Signal Voltage Fault Output Supply Voltage Fault Output Current
Conditions
Applied between VCC(UH), VCC(VH), VCC(WH), VCC(L) COM Applied between VB(U) - VS(U), VB(V) - VS(V), VB(W) VS(W) Applied between IN(UH), IN(VH), IN(WH), IN(UL), IN(VL), IN(WL) - COM Applied between VFO - COM Sink Current at VFO Pin
Rating
20 20 -0.3~17 -0.3~VCC+0.3 5 -0.3~VCC+0.3
Units
V V V V mA V
Current Sensing Input Voltage Applied between CSC - COM
Total System Symbol
VPN(PROT) TC TSTG VISO
Parameter
Self Protection Supply Voltage Limit (Short Circuit Protection Capability) Module Case Operation Temperature Storage Temperature Isolation Voltage
Conditions
VCC = VBS = 13.5 ~ 16.5V TJ = 125C, Non-repetitive, less than 2s -20C TJ 125C, See Figure 2 60Hz, Sinusoidal, AC 1 minute, Connection Pins to ceramic substrate
Rating
400 -20 ~ 100 -40 ~ 125 2500
Units
V C C Vrms
Thermal Resistance
Symbol
Rth(j-c)Q Rth(j-c)F
Note: 2. For the measurement point of case temperature(TC), please refer to Figure 2.
Parameter
Junction to Case Thermal Resistance
Conditions
Inverter IGBT part (per 1/6 module) Inverter FWD part (per 1/6 module)
Min.
-
Typ.
-
Max.
2.02 3.15
Units
C/W C/W
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FSBB15CH60 Smart Power Module
Electrical Characteristics (TJ = 25C, Unless Otherwise Specified)
Inverter Part Symbol
VCE(SAT) VF HS tON tC(ON) tOFF tC(OFF) trr LS tON tC(ON) tOFF tC(OFF) trr ICES
Note: 3. tON and tOFF include the propagation delay time of the internal drive IC. tC(ON) and tC(OFF) are the switching time of IGBT itself under the given gate driving condition internally. For the detailed information, please see Figure 4.
Parameter
Collector-Emitter Saturation Voltage FWD Forward Voltage Switching Times
Conditions
VCC = VBS = 15V VIN = 5V VIN = 0V IC =15A, TJ = 25C IC = 15A, TJ = 25C
Min.
-
Typ.
0.4 0.28 0.67 0.35 0.10 0.55 0.24 0.73 0.34 0.10 -
Max.
2.3 2.1 250
Units
V V s s s s s s s s s s A
VPN = 300V, VCC = VBS = 15V IC = 15A VIN = 0V 5V, Inductive Load (Note 3)
VPN = 300V, VCC = VBS = 15V IC = 15A VIN = 0V 5V, Inductive Load (Note 3)
-
Collector-Emitter Leakage Current
VCE = VCES
-
100% IC 100% I C
trr
V CE
IC
IC
V CE
V IN t ON t C(ON)
V IN(ON) 10% IC 90% I C 10% V CE
V IN
0
t OFF
V IN(OFF) 10% V CE
tC(OFF)
10% I C
(a) turn-on
(b) turn-off
Figure 4. Switching Time Definition
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FSBB15CH60 Smart Power Module
Electrical Characteristics (TJ = 25C, Unless Otherwise Specified)
Control Part Symbol
IQCCL IQCCH IQBS VFOH VFOL VSC(ref) UVCCD UVCCR UVBSD UVBSR tFOD VIN(ON) VIN(OFF)
Note:
Parameter
Quiescent VCC Supply Current
Conditions
VCC = 15V IN(UL, VL, WL) = 0V VCC = 15V IN(UH, VH, WH) = 0V VCC(L) - COM VCC(UH), VCC(VH), VCC(WH) - COM VB(U) - VS(U), VB(V) -VS(V), VB(W) - VS(W)
Min.
4.5 0.45 10.7 11.2 10.1 10.5 1.0 3.0 -
Typ.
0.5 11.9 12.4 11.3 11.7 1.8 -
Max.
23 100 500 0.8 0.55 13.0 13.2 12.5 12.9 0.8
Units
mA
A A
Quiescent VBS Supply Current Fault Output Voltage Short Circuit Trip Level Supply Circuit UnderVoltage Protection
VBS = 15V IN(UH, VH, WH) = 0V
VSC = 0V, VFO Circuit: 4.7k to 5V Pull-up VSC = 1V, VFO Circuit: 4.7k to 5V Pull-up VCC = 15V (Note 4) Detection Level Reset Level Detection Level Reset Level
V V V V V V V ms V V
Fault-out Pulse Width ON Threshold Voltage OFF Threshold Voltage
CFOD = 33nF (Note 5) Applied between IN(UH), IN(VH), IN(WH), IN(UL), IN(VL), IN(WL) - COM
4. Short-circuit current protection is functioning only at the low-sides. 5. The fault-out pulse width tFOD depends on the capacitance value of CFOD according to the following approximate equation : CFOD = 18.3 x 10-6 x tFOD[F]
Recommended Operating Conditions
Symbol
VPN VCC VBS
Parameter
Supply Voltage Control Supply Voltage High-side Bias Voltage
Conditions
Applied between P - NU, NV, NW Applied between VCC(UH), VCC(VH), VCC(WH), VCC(L) - COM Applied between VB(U) - VS(U), VB(V) - VS(V), VB(W) - VS(W)
Value Min.
13.5 13.0 -1 2.0 -4
Typ.
300 15 15 -
Max.
400 16.5 18.5 1 20 4
Units
V V V V/s
s
DVCC/Dt, Control supply variation DVBS/Dt tdead fPWM VSEN Blanking Time for Preventing For Each Input Signal Arm-short PWM Input Signal Voltage for Current Sensing -20C TC 100C, -20C TJ 125C Applied between NU, NV, NW - COM (Including surge voltage)
kHz V
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Mechanical Characteristics and Ratings
Parameter
Mounting Torque Device Flatness Weight Mounting Screw: - M3
Condition
Recommended 0.62N*m Note Figure 5
Limits Min.
0.51 0 -
Typ.
0.62 15.00
Max.
0.72 +120 -
Units
N*m
m
g
(+)
(+)
Figure 5. Flatness Measurement Position
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FSBB15CH60 Smart Power Module
Time Charts of SPMs Protective Function
Input Signal Protection Circuit State
UVCCR
RESET
a1
SET
RESET
a6
Control Supply Voltage
UVCCD a2
a3 a4 a7
Output Current Fault Output Signal
a5
a1 : Control supply voltage rises: After the voltage rises UVCCR, the circuits start to operate when next input is applied. a2 : Normal operation: IGBT ON and carrying current. a3 : Under voltage detection (UVCCD). a4 : IGBT OFF in spite of control input condition. a5 : Fault output operation starts. a6 : Under voltage reset (UVCCR). a7 : Normal operation: IGBT ON and carrying current.
Fig. 6. Under-Voltage Protection (Low-side)
Input Signal Protection Circuit State
UVBSR
RESET
b1
SET
RESET
b5
Control Supply Voltage
UVBSD b2
b3 b6 b4
Output Current
High-level (no fault output)
Fault Output Signal
b1 : Control supply voltage rises: After the voltage reaches UVBSR, the circuits start to operate when next input is applied. b2 : Normal operation: IGBT ON and carrying current. b3 : Under voltage detection (UVBSD). b4 : IGBT OFF in spite of control input condition, but there is no fault output signal. b5 : Under voltage reset (UVBSR) b6 : Normal operation: IGBT ON and carrying current
Fig. 7. Under-Voltage Protection (High-side)
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Lower arms control input Protection circuit state Internal IGBT Gate-Emitter Voltage
c2
c6
c7
SET
c4
RESET
c3
SC
c1
Output Current
c8
Sensing Voltage of the shunt resistance Fault Output Signal
c5
SC Reference Voltage
CR circuit time constant delay
(with the external shunt resistance and CR connection) c1 : Normal operation: IGBT ON and carrying current. c2 : Short circuit current detection (SC trigger). c3 : Hard IGBT gate interrupt. c4 : IGBT turns OFF. c5 : Fault output timer operation starts: The pulse width of the fault output signal is set by the external capacitor CFO. c6 : Input "L" : IGBT OFF state. c7 : Input "H": IGBT ON state, but during the active period of fault output the IGBT doesn't turn ON. c8 : IGBT OFF state
Fig. 8. Short-Circuit Current Protection (Low-side Operation only)
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5V-Line
R PF = 4.7k
SPM
IN (UH) , IN (VH) , IN(W H)
CPU
100 1nF C PF = 1nF
IN (UL) , IN (VL) , IN (W L) VFO
COM
Note:
1. RC coupling at each input (parts shown dotted) might change depending on the PWM control scheme used in the application and the wiring impedance of the application's printed circuit board. The SPM input signal section integrates 3.3k(typ.) pull-down resistor. Therefore, when using an external filtering resistor, please pay attention to the signal voltage drop at input terminal. 2. The logic input is compatible with standard CMOS or LSTTL outputs.
Fig. 9. Recommended CPU I/O Interface Circuit
These Values depend on PW M Control Algorithm
15V-Line
R E(H)
R BS
D BS
One-Leg Diagram of SPM
P
Vcc VB HO
22uF
0.1uF
IN
COM VS
Vcc
Inverter Output
OUT
1000uF
1uF
IN
COM VSL
N
Note:
1. It would be recommended that the bootstrap diode, DBS, has soft and fast recovery characteristics. 2. The bootstrap resistor (RBS) should be 3 times greater than RE(H). The recommended value of RE(H) is 5.6, but it can be increased up to 20 (maximum) for a slower dv/dt of high-side. 3. The ceramic capacitor placed between VCC-COM should be over 1F and mounted as close to the pins of the SPM as possible.
Fig. 10. Recommended Bootstrap Operation Circuit and Parameters
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RE(WH) RE(VH) 15V line RE(UH) RBS DBS
P (27)
(19) VB(W) (18) VCC(WH)
VB VCC COM IN OUT VS
W (26)
Gating WH RBS
CBS
CBSC
(17) IN(WH) (20) VS(W)
DBS
(15) VB(V) (14) VCC(VH)
VB VCC COM IN OUT VS
V (25)
Gating VH
CBS
CBSC
(13) IN(VH) (16) VS(V)
M
CDCS Vdc
C P U
RBS
DBS
(11) VB(U) (10) VCC(UH)
VB VCC COM IN OUT VS
U (24)
Gating UH RF
CBS
CBSC
(9) IN(UH) (12) VS(U)
5V line RPF
CSC CFOD
(8) CSC (7) CFOD (6) VFO
C(SC) OUT(WL) C(FOD) VFO IN(WL) OUT(VL) IN(VL) IN(UL) COM VCC OUT(UL) VSL
NU (21) NV (22) NW (23)
Fault Gating WL Gating VL Gating UL
RS
RSW
(5) IN(WL) (4) IN(VL) (3) IN(UL)
RSV
CBPF
CPF
(2) COM (1) VCC(L)
RSU
CSP15
CSPC15
Input Signal for ShortCircuit Protection
W-Phase Current V-Phase Current U-Phase Current
CFW CFV CFU
RFW RFV RFU
Note:
1. To avoid malfunction, the wiring of each input should be as short as possible. (less than 2-3cm) 2. By virtue of integrating an application specific type HVIC inside the SPM, direct coupling to CPU terminals without any opto-coupler or transformer isolation is possible. 3. VFO output is open collector type. This signal line should be pulled up to the positive side of the 5V power supply with approximately 4.7k resistance. Please refer to Figure. 9. 4. CSP15 of around 7 times larger than bootstrap capacitor CBS is recommended. 5. VFO output pulse width should be determined by connecting an external capacitor(CFOD) between CFOD(pin7) and COM(pin2). (Example : if CFOD = 33 nF, then tFO = 1.8ms (typ.)) Please refer to the note 5 for calculation method. 6. Input signal is High-Active type. There is a 3.3k resistor inside the IC to pull down each input signal line to GND. When employing RC coupling circuits, set up such RC couple that input signal agree with turn-off/turn-on threshold voltage. 7. To prevent errors of the protection function, the wiring around RF and CSC should be as short as possible. 8. In the short-circuit protection circuit, please select the RFCSC time constant in the range 1.5~2 s. 9. Each capacitor should be mounted as close to the pins of the SPM as possible. 10. To prevent surge destruction, the wiring between the smoothing capacitor and the P&GND pins should be as short as possible. The use of a high frequency non-inductive capacitor of around 0.1~0.22 F between the P&GND pins is recommended. 11. Relays are used at almost every systems of electrical equipments of home appliances. In these cases, there should be sufficient distance between the CPU and the relays. 12. CSPC15 should be over 1uF and mounted as close to the pins of the SPM as possible.
Fig. 11. Typical Application Circuit
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Detailed Package Outline Drawings
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FSBB15CH60 Smart Power Module
Detailed Package Outline Drawings (Continued)
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FSBB15CH60 Smart Power Module
Detailed Package Outline Drawings (Continued)
FSBB15CH60 Rev. C
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FSBB15CH60 Smart Power Module
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM
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FAST(R) FASTrTM FPSTM FRFETTM GlobalOptoisolatorTM GTOTM HiSeCTM I2CTM i-LoTM ImpliedDisconnectTM
Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM
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POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM SILENT SWITCHER(R) SMART STARTTM
SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHCTM UltraFET(R) UniFETTM VCXTM
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Formative or In Design First Production
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Preliminary
No Identification Needed
Full Production
Obsolete
Not In Production
Rev. I15
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